Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices.
Microchip Technology (MCHP) Launches a New System-in-Package for Automotive Human-Machine Interfaces
​Microchip Technology Incorporated (NASDAQ:MCHP) develops semiconductor products, including microcontrollers, analog and connectivity devices, and timing solutions. The company also generates ...
Low thermo-mechanical stress, low capacitance, high max forward surge current, low forward voltage and smaller peak reverse current in space-saving package Our new 1A/2A automotive-grade 1,200V, ...
During the Cold War, the CIA explored some unusual ideas for surveillance. One of the strangest involved a house cat. In the 1960s, the agency launched a project that surgically implanted a microphone ...
First they came for our wrists, now wearable innovators want to adorn our digits with sensor-laden trackers. And if you’ve always fancied daily health insights and advice in a more discreet package ...
A tech company's new contactless brainwave sensor can detect drivers' fatigue and distraction. When the sensor reaches fleets, it could provide early warnings before physical signs of fatigue manifest ...
where I Dmax is the maximum DC current and R DS(on) is the temperature-dependent device on-state resistance. This peak drain current increases as the device R DS(on) is scaled lower or if the T c can ...
Navitas Semiconductor has released sample units of its new 3300 V and 2300 V ultra-high-voltage silicon carbide (SiC) MOSFETs, available in power-module formats, discrete packages, and known-good-die ...
A SHAW poster promoting their free glovebox program. Students are able to order up to 3 free boxes containing safe sex supplies a semester. Photo courtesy of @uconnstudenthealth on Instagram ...
To make the G2's new UI and menu easier to use, Even Realities went so far as to make a whole new companion ring (the R1) that features a tiny built-in touchpad. (Sam Rutherford for Engadget) A lot of ...
Companies to second source selected packages for SiC power chips with plans to expand to GaN in the future Rohm and Infineon have signed an agreement to collaborate on packages for SiC power ...
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