IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Researchers at Pohang University of Science and Technology (POSTECH) have developed an artificial intelligence approach that addresses a key bottleneck in analog semiconductor layout design, a process ...