Continued pressure for electronic devices that provide greater functionality in ever-smaller form-factors is not only providing the driving force behind developing smaller surface-mount components and ...
In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
SAN DIEGO--(BUSINESS WIRE)--Altium, the global leader in PCB design software, is partnering with IHS Markit Electronic Parts Solutions to solve one of the major challenges in PCB design. When ...
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