For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and ...
A key element of Mitsubishi’s new forged molding compound (FMC) carbon fiber-reinforced SMC is the use of low-flow (but not low-pressure) compression molding, which ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results